Huawei Technologies has released a new research paper showing its Tau Scaling Law-based semiconductor architecture can avoid overheating, which analysts view as a key technical hurdle for its anticipated Kirin 2026 smartphone chip. The paper, authored by He Tingbo, chairwoman of the Huawei Scientist Committee and president of the company’s semiconductor business department, rebutted scepticism that vertically stacking logic circuits would create an insurmountable thermal bottleneck. It was...